Noise Coupling At System Level

Instructor: Dr. Cosmin Iorga

Class Description:

This class expands the knowledge of noise coupling from integrated circuit level to package, PCB, and multi-PCB systems.  The covered topics include:

• Power distribution in backplanes and multi-board systems

• System ground and reference voltages

• Noise coupling mechanisms at chip, package, PCB, and system level

• Noise coupling in multi-chip-modules (MCM), system-in-package (SIP),

• System-on-chip (SoC)

• Crosstalk and ground bounce

• Electromagnetic radiation

• Shielding techniques

• Penetration depth of electromagnetic field into shield materials

• Efficiency of electromagnetic shields

• Grounding techniques

• Ground loops and electromagnetic induction

• How to identify and avoid ground loops

Each of these topics is analyzed first by building a strong intuitive understanding of the physical principles that describes it and second by developing the mathematical analysis skills needed by engineers and designers in their daily work.

What attendees will gain:

After completing this class, attendees are expected to be able to thoroughly analyze various aspects of noise coupling issues at chip, package, PCB, and system levels and provide highly innovative solutions.  System architects are expected to be able to identify noise coupling problems early in the design process and come up with solutions and guidelines for reducing the noise generation in digital circuits, suppressing the noise propagation, and minimizing the noise injection into sensitive circuits.