Advanced Signal and Power Integrity on Chip, Package, and PCB

Instructor: Dr. Cosmin Iorga

Class Description:

This an advanced level class for experienced engineers and designers who want to explore in more details the signal and power integrity field.  The covered topics include: 

• Chip, Package, and PCB interconnects
• Lumped versus distributed interconnects
• Transmission lines discontinuities
• Differential TDR method
• Transient currents in the return path
• Via inductance
• S-Parameters
• Insertion and return loss
• Vector network analyzer techniques
• Differential transmission lines
• Differential characteristic impedance
• On-chip line drivers
• Power distribution effects on driver output impedance
• How to design transmission line terminations
• Lossy transmission lines
• Dielectric absorption
• Inter-symbol interference
• Modeling lossy transmission lines
• Capacitive and Inductive Crosstalk
• Near end versus far end crosstalk
• Ground bounce effect on signal integrity
• Random versus deterministic timing jitter
• PCB materials and stack up optimization
• Characteristic impedance control in PCB manufacture
• Advanced analysis of interconnects – eliminating the fixture effects

What attendees will gain:

After completing this class, attendees are expected to be able to thoroughly analyze various aspects of signal integrity problems at chip, package, PCB, and system levels and provide highly innovative solutions.  System architects are expected to be able to estimate the effects of signal integrity at system level and to create design guidelines for preserving the signal integrity across system interconnects.