Advanced Signal and Power Integrity on Chip, Package, and PCB
Instructor: Dr. Cosmin Iorga
Class Description:
This an advanced level class for experienced engineers and designers who want to explore in more details the signal and power integrity field. The covered topics include:
Chip, Package, and PCB interconnects
Lumped versus distributed interconnects
Transmission lines discontinuities
Differential TDR method
Transient currents in the return path
Via inductance
S-Parameters
Insertion and return loss
Vector network analyzer techniques
Differential transmission lines
Differential characteristic impedance
On-chip line drivers
Power distribution effects on driver output impedance
How to design transmission line terminations
Lossy transmission lines
Dielectric absorption
Inter-symbol interference
Modeling lossy transmission lines
Capacitive and Inductive Crosstalk
Near end versus far end crosstalk
Ground bounce effect on signal integrity
Random versus deterministic timing jitter
PCB materials and stack up optimization
Characteristic impedance control in PCB manufacture
Advanced analysis of interconnects – eliminating the fixture effects
What attendees will gain:
After completing this class, attendees are expected to be able to thoroughly analyze various aspects of signal integrity problems at chip, package, PCB, and system levels and provide highly innovative solutions. System architects are expected to be able to estimate the effects of signal integrity at system level and to create design guidelines for preserving the signal integrity across system interconnects.